Sitel - Printed Circuit Boards in alluminium

FOR ALL THOSE APPLICATIONS THAT REQUIRE AN ELEVATED HEAT DISSIPATION

Materials used

CEM3 High Thermal

IMS materials

Substrate: alluminum, copper Dielectric: ceramic, fillered Copper: 35, 70, 105 µm Alluminum/dieletctric flexible materials, with ductile copper

Treatments

Drilling: CNC-Punching, Punching Solder resist: UV-Photografic (with anti yellowing pigmentations), Silk-screen

Thickness of base laminate

1,0 - 1,5 - 2,0 - 3,0 mm

Thickness of base copper

35-70-105 µm

Mechanical finisches

Milling, Scoring+Jump, Punching, Flaring

Surfaces finisches

Hal Lead Free, Cu passived

Electrical test

Low and High voltage, AOI

Approval